IPC

General documents

• IPC-T-50 Terms and Definitions
• IPC-2615 Printed Board Dimensions and Tolerances
• IPC-D-325 Documentation Requirements for Printed Boards
• IPC-A-31 Flexible Raw Material Test Pattern
• IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards

Design specifications

• IPC-2612 Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
• IPC-2221 Generic Standard on Printed Board Design
• IPC-2223 Sectional Design Standard for Flexible Printed Boards
• IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standards

Material specifications

• IPC-FC-234 Pressure Sensitive Adhesives Assembly Guidelines for Single-Sided and Double-Sided Flexible Printed Circuits
• IPC-4562 Metal Foil for Printed Wiring Applications
• IPC-4101 Laminate Prepreg Materials Standard for Printed Boards
• IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry
• IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
• IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

Performance and inspection documents

• IPC-A-600 Acceptability of Printed Boards
• IPC-A-610 Acceptability of Electronic Assemblies
• IPC-6011 Generic Performance Specification for Printed Boards
• IPC-6012 Qualification and Performance Specification for Rigid Printed Boards
• IPC-6013 Specification for Printed Wiring, Flexible and Rigid-Flex
• IPC- 6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
• PAS-62123 Performance Guide Manual for Single & Double Sided Flexible Printed Wiring Boards
• IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards

Flex assembly and materials standards

• IPC-FA-251 Assembly Guidelines for Single and Double Sided Flexible Printed Circuits
• IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives
• IPC-3408 General Requirements for An isotopically Conductive Adhesives Films