Logic Symbol Creation
Flat /Hierarchical Design
Analog, Digital and Mixed Signal Design capture
Fast Turnaround Time
Experienced in schematic capturing including Symbol creation in ORCAD, PADS
Logic and DX-Designer
Library Development:
Schematic Symbols
PCB Footprints
Expertise in library creation as per IPC 7351 Std
PCB Layout Design:
Single-sided to Multi-layer boards (30 Layers)
Metal Clad/Core PCBs
Expertise in High speed Analog, Digital and Mixed signal Layout Designs
Expertise in routing high Speed differential pairs up to
10GHz-SATA,SAS,HDMI,USB,XAUI,SGMII,PCIe,SRIO etc with tight skew matching
Designs with Fine Pitch Micro BGAs
CPWG Routing for High Speed signals
Complex PCBs and back planes: Density more than 500 pins per square inch
Surface mount, Through-Hole, and Mixed Technology
HDI Designs with micro vias, Via-in-Pad, laser micro vias (Blind and
Buried).
PCB Designs for space, military, medical and commercial applications
Careful Layout Design to avoid Signal integrity and EMI/EMC related issues
PCB Layer management for signal integrity and impedance control
DDR, DDR2, DDR3 memory interface with very tight skew matching
High density SMT designs (BGA, PCI, PCIE Gen 1, 2, 3, CPCI...)
Regid/Flex PCB designs of all types
Fabrication documents/Artwork creation
ODB++ data output
Better understanding of PCB form factor, DXF and mechanical constraints.
Setting-up the Design Rules for verification of every aspect of the PCB
layout in DFM, DFA and DFT.
Mechanically constrained PCB’s
Motherboards, Single Board computers, High speed Serial Backplanes.
ASIC Test Boards, Load Boards, Probe Cards, Burn-in Boards, sockets.
Faster turnaround time
Familiar with Following:
pre
& post layout and creating design constraint based on the results.
RF/Microwave circuit, Flex Designs, Digital Design.
power analog circuit design techniques
Multi-layer high speed PCB techniques.
Short
Range Wireless technology i.e., Wi-Fi, BLE, ZigBee or Z-wave
802.15.4,
RFID, Proximity, and Smart card technologies
ARM
/ Microcontroller Experience - TI, i.Mx, Qualcomm, Renesas, Xilinx, Altera
FPGA.
Experience
in High speed design like DDRx, PCIe, MIPI, LVDS interfaces
Audio
and Video Design Experience - Cameras, LCD, HDMI, NTSC/CVBS
SPI4,
XAUI, XFI, SFI-PCIe Gen1 2 protocol and physical layer,
Experience
in various standard bus architecture and interfaces such as PCIe, SAS, SATA,
USB, SPI, I2C, SD, eMMC, MIPI (UFS) etc....
Communications Protocols; UART, SPI, I2C,
RS232, USB, Ethernet
Intense
knowledge of CES, Stackup, board cross section, impedance details.
Ethernet over backplane
Fiber Channel (SFP+, QSF) , DDRx
1/10G Line Card, USB, Bluetooth,
WIFI
SERDES, XAUI, SRIO, GPS, RF &
Microwave
USB, SATA, HDMI, SAS3, NVMe,
HDD/SSD, SAS expanders
PCIe switches/controllers, PCIe
add-on
PXIe, LXI, VXI, VME, High Vg/ Ct,
RTD
Switch / Matrix cards, Digital
I/O Cards, Backplanes
QPI/UPI, PCIE, DMI, QSGMII, SGMII
DDR4/3/2, RLDRAM, QDR, LPDDR
PCI Express, PCI Express 2.0, PCI
Express 3.0
High Vg/ Ct, RTD, Break Out Box
Handled Up to 100 Gbps!!!
Peripherals worked : UART, SPI, I2C, HDMI, CAN
Interfaces : RS232,RS485,CAN
Processors worked : PIC16F & 12F, Atmel Family,Silabs
Modules Worked : Amplifiers, DC to DC Converter, DAC, GSM, GPS, PWM
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