PCB
Manufacturing
Layers (2-40)
Lines and Spaces (Volume
3/3 Prototype 2/2)
Controlled Impedance (+/-
10% Standard)
Blind and Buried Vias
Buried Capacitance
µvias
High Performance and
Emerging Materials
Sequential Lamination
Ultra-Fine Pitch (0.8,
0.5, 0.4, 0.3 mm)
Advanced Technologies
High Aspect Ratio Hole
Plugging
Back Drilling
Fine Line Approach:
LD/Line Width/Line Space: 2mil/2mil
UV ink Outer Through Hole
Plugging
PCB
Assembly Services:
Prototype and High volume
Assembly
ROSH / Lead free PCB Assembly
BGA and Micro-BGA
Capabilities
Through-Hole Assembly
Surface-Mount Assembly
Cable & Harnesses
Assembly
Mechanical Assembly
Mixed Technology Assembly
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